CNC/Laser Drill & Router

• CNC Drill
• Drill hole machining process for conduction between layer and layer

Equipment	Process

• Laser Drill
• Laser processing to form via holes in the insulator

Equipment	Process

• Router
• Product external form Processing

Equipment	Process

MLB

• Oxide
• Copper surface oxidation film formation

Equipment	Process

• Lay-up
• Stack materials according to product structure

Equipment	Process

• Hot Press
• Harden raw materials through heating and pressing

Equipment	Process

Plating

• Desmear
• Removing the suspended matter in the via hole

Equipment	Process

• Chemical Plating
• Form a thin plated layer through chemical reaction

Equipment	Process

• Electrolytic plating
• Copper plating through electricity

Equipment	Process

D/F

• Exposure
• Use dry film laminating products with laser light source and harden desired parts

Equipment	Process

• Etching
• Implementation of product circuit through develop, Etching and stripp process

Process

• AOI
• Pre-check of product quality through image matching

Equipment	Process

PSR & Surface Treatment

• PSR (Photo Solder Resist)
• Protect plated circuit on pcb surface by applying ink to substrate surface

Equipment	Process

• ENIG (Electroness Nikel Immersion Gold)
• Copper coating with no ink applied for oxidation prevention and SMT ease (Ni/Au Plating)

Equipment	Process

• OSP (Organic Solderability Preservatives)
• Copper coating with no ink applied for oxidation prevention and SMT ease (Pre-Flux Coating)

Equipment	Process

• TIN (Immersion Tin)
• Chemical tin plating method for copper foil coating to prevent oxidation (Sn Plating)

Equipment	Process