R&D Status
- D/F circuit develop technology
- MLB Technology
- Laser / CNC drill optimal machinability
- PSR / Surface treatment
- Via hole plating technology
R&D
R&D Overview
High digital technology power of
DAP will lead the world
Technology Road Map
| 2015 | 2018 | 2022 | 2025 | |
|---|---|---|---|---|
| Structure |  D, 3D Type (12L) |
 Any-layer (12L) |
 Any-layer (12L) |
 Any-layer (12L) |
| Line / Space |  30/40(µm) |
 30/40(µm) |
 30/30(µm) |
 25/25(µm) |
