Best Quality
Realization of best competitive power
Optimum Lead Time
Company
Innovative Strategy
High digital technology power of
DAP will lead the world
Best Quality
Within Processing System
Speed up and reduce lead time by within processing system
| Division | Innovation | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Overview |
From the material carry-in to deliver the PCB product, simplification the work processes and product transportation paths by within processing system, and concentrating on reducing Lead Time which is strength of the DAP. |
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| Detail |
See the table below Delivery
|
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| Division | Sample | Mass | |||
|---|---|---|---|---|---|
| special | Normal | special | Normal | ||
| HDI | C Type | 2.9 | 3.5 | 11.0 | 12.0 |
| D Type | 3.0 | 3.9 | 12.0 | 13.0 | |
| 3D Type | 3.4 | 4.3 | 12.5 | 14.0 | |
| 4D Type | 3.5 | 4.6 | 13.0 | 14.5 | |
| Any Layer | 3.6 | 4.8 | 14.0 | 16.5 | |
| Average | 3.3 | 4.2 | 11.7 | 13.2 | |
Delivery
Andon System
Operation of Andon System
| Division | Innovation |
|---|---|
| Overview | If problems are occurred during producing the products on the line, alarm will be activated to notice the problem and indicate relating locations. And, help to response quickly by visualizing problems of producing line. |
| Detail |  The Visual management by creating the Andon System to reduce the facility non-operating loss. |
Quick Changing
Model Quick Change Standardization
| Division | Innovation |
|---|---|
| Overview | Remove unnecessary movements throughout the Model change competition, operation analyze improvement activity and etc, and throughout the activities of standardization and improvement, response to the multi-type models quickly. |
| 세부내용 |  Model Change Analysis / Monitoring |
Slim PCB Tech
PCB quality improvement technology with thinner product thickness
| Division | Innovation | ||
|---|---|---|---|
| Thickness |  |
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| Detail |  PCB Thickness Control |
 PCB Bow & Twist |
 PCB Stiffness |
Fine Pitch Tech
Improved PCB micro-circuit implementation ability
| Division | Innovation | ||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Detail |
* Fine Pattern Tech, 30/40 난이도 See the table below Fine Pattern Tech (2Trace Line)
Difficulty 30/40(2Trace)
|
BGA Pitch  |
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0.38 Pitch  |
0.35 Pitch  |
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| Fine Pattern Tech (2Trace Line) | ||
|---|---|---|
| Items(µm) | 0.38Pitch | 0.35Pitch |
| Line/Space | 40/40µm | 30/40µm |
| Ball Pad | 180µm | 170µm |
| Annular Ring | 45µm | 40µm |
| Difficulty 30/40(2Trace) | |||
|---|---|---|---|
| Items | Line | Space | PAD |
| Single Line | 40 | 40 | 180 |
| Double Line | 30 | 40 | 170 |
Any Layer Tech
All Layer Laser Via Hole & Via Filling Method
| Division | Innovation | |
|---|---|---|
| Stack Change |  |
|
| Detail |  |
Type : All Stack Via L/S=30/40µm S/R Clearance 30µm BGA 0.32pitch |
Line Stop System
‘Line stop system’ that prevent the recurrence of inferior products and never move to next processes
| Division | Innovation |
|---|---|
| Overview | System that re-operate after verification by ‘in the field, watch the real problem, understand actual problem’ to improve immediately by assembling the conference with person in charge by activating the Line Stop Alarm |
| Detail |  Process Flow |
Final Inspection
Same test quality to all inspection products can maintain product quality
| Division | Innovation |
|---|---|
| Overview | Methods that compare the appearance of completed PCB product with registered image and images of Camera. Its reliability and productivity is very excellent than visual inspection. |
| Detail |
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