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제품소개

제품소개

첨단 디지털 기술로 세상을 이끌어 가는 힘,
디에이피가 만들어 갑니다.

HDI PCB Structure

A. LVH (Laser Via Hole)

B. Stacked Via

C. BVH (Buried Via Hole)

D. PTH (Plated Through Hole)

E. CCL (Copper Clad Laminate)

F. P/P (Prepreg)

G. C/F (Copper Foil)

H. S/R Ink (Solder Resist Ink)

 

Any Layer

Structure Cross Section
  • Specification
Type Material Board Thickness Min Line Space
All Stack Via FR-4 0.65~1.0T (±10%) 0.03/0.04

 

4D Type

Structure Cross Section
  • Specification
Layer Count Material Board Thickness Min Line Space
10 Layer FR-4 0.65~1.0T(±10%) 0.04/0.04

 

3D Type

Structure Cross Section
  • Specification
Layer Count Material Board Thickness Min Line Space
10 Layer FR-4 0.6~1.0T(±10%) 0.04/0.04, 0.04/0.085

 

D Type

Structure Cross Section
  • Specification
Layer Count Material Board Thickness Min Line Space
10 Layer FR-4 0.8T 0.04/0.04, 0.05/0.05

 

C Type

Structure Cross Section
  • Specification
Layer Count Material Board Thickness Min Line Space
10 Layer FR-4 0.65~0.8T 0.04/0.04, 0.05/0.05

 

B Type

Structure Cross Section
  • Specification
Layer Count Material Board Thickness Min Line Space
10 Layer FR-4 0.65~0.8T 0.04/0.08, 0.05/0.05

 

BVH Type

Structure Cross Section
  • Specification
Layer Count Material Board Thickness Min Line Space
8 Layer FR-4, Teflon 0.9~1.1T 0.12/0.15